A novel stack PCB structure for X-band cavity bandpass filter implementation

作者：Zheng, Bing-Long; Wong, Sai-Wai; Wu, Yu-Ming; Chu, Qing-Xin

来源：2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017, Suzhou, China, 2017-08-01 To 2017-08-04.

• Air-filled cavities
• Cavity filters
• Central frequency
• Copper deposition
• Packaging technologies
• Printed circuit boards (PCB)
• Transmission zeros
• X-band frequencies

A novel printed-circuit-board (PCB) structure is used to construct a 2nd-order annular cavity bandpass filter and a novel packaging technology are presented in this letter. The PCB has the treatment of shaped-cut, copper-deposition, and stack-management to generate the air cavity structure. A 2nd-order bandpass air-filled cavity filter with two transmission zeros at lower- and upper-stopband is designed, which has a central frequency at 9.88 GHz and a bandwidth of 1.8%. To validate the proposed concept, the proposed 2nd-order bandpass filter is fabricated. The measured insertion loss is around 1.6dB. The measured result has a reasonably good agreement with the simulated result in X-band frequency.

• 出版日期2017
• 单位华南理工大学