Application of glycine containing solutions for electroless deposition of Co-P and Co-W-P films and their behavior as barrier layers

作者：Tarozaite Rima; Sukackiene Zita; Sudavicius Aloyzas; Juskenas Remigijus; Selskis Algirdas; Jagminiene Aldona; Norkus Eugenijus^*

来源：Materials Chemistry and Physics, 2009, 117(1): 117-124.

DOI：10.1016/j.matchemphys.2009.05.016

• Electroless deposition
• Cobalt
• Tungsten
• Glycine
• Dicarboxylic acids
• Barrier layer

Co-P and Co-W-P alloy films were deposited by the electroless plating method on Cu foil or on Cu deposited by sputtering on a Ta/SiO(2)/Si/substrate. Dicarboxylic acids, used as buffering additives, increase the deposition rate and P quantity in the films. The cobalt deposition rate and P quantity in the films decrease with incorporation of tungsten into the films. AFM, XRD and XPS data indicate the differences between the structure of Co-P and Co-W-P films and confirm that Co-W-P films deposited from glycine containing solutions can serve as a perfect diffusion barrier layer to prevent Cu diffusion.

• 出版日期2009-9-15