Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling

作者：Verma P; Chatterjee D^*; Nagarajan T

来源：Proceedings of the Institution of Mechanical Engineers - Part C: Journal of Mechanical Engineering Science , 2009, 223(4): 953-963.

DOI：10.1243/09544062JMES1315

• modular
• valveless micropump
• piezoelectric
• printed circuit board
• integrated cooling
• heat sink

With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 V(DC). Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5W. A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump.

• 出版日期2009-4