An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs)

作者：Cheng Chi Hsuan^*; Wu Tzong Lin

来源：IEEE Transactions on Electromagnetic Compatibility, 2016, 58(4): 1128-1135.

DOI：10.1109/TEMC.2016.2543246

• Common-mode filter
• electromagnetic interference (EMI)
• equivalent circuit model
• radio-frequency interference (RFI)
• three-dimensional integrated circuits
• through-silicon via

In this paper, the radiation of signaling channel that may lead to noise coupling, electromagnetic interference or radiofrequency interference problems in three-dimensional integrated circuits (3-D ICs) is discussed. To improve the electromagnetic compatibility, a common-mode filter (CMF) based on the silicon interposer process with through-silicon vias (TSV) is proposed. A differential second-order T-model circuit for transmission lines with a common inductance is proposed to characterize and design the stopband and corresponding two transmission zeros for common mode (CM). Codesigned with through-silicon vias, this TSV-based CMF (TSV-CMF) is implemented in a cost-efficient interposer process and the measurement results match well to both the equivalent circuit model and full-wave simulation. It is measured that the differential bandwidth of the TSV-CMF can reach 25 GHz and CM stopband is around 15 GHz with 20% fractional bandwidth. In addition, the suppressing frequency and bandwidth can be easily altered and improved by using more stacked chips on the interposer.

• 出版日期2016-8