Abrasive electrochemical multi-wire slicing of solar silicon ingots into wafers

作者：Wang W^*; Liu Z X; Zhang W; Huang Y H; Allen D M

来源：CIRP Annals - Manufacturing Technology, 2011, 60(1): 255-258.

DOI：10.1016/j.cirp.2011.03.069

• Hybrid machining
• Silicon
• Wafer

To meet the growing demands of the global photovoltaic (PV) industry, preparing large scale and ultrathin solar wafers becomes one of the key issues. This paper presents the preparatory investigations of slicing solar silicon ingot into wafers by an abrasive electrochemical method based on a multi-wire saw system. The anodic passivation on silicon can be controlled by applying an anodic potential during the mechanical slicing process, which improves the surface integrity and material removal rate remarkably. This new hybrid machining method has no influence on subsequent cleaning of wafers and preparing the solar cells, and the average photoelectric transformation efficiency is >17.5%.

• 出版日期2011
• 单位南京航空航天大学